台积电开发人工智能芯片封装技术以对抗英特尔
【台积电开发人工智能芯片封装技术以对抗英特尔】金色财经报道,7月30日,据两位直接了解该项目的人士透露,台积电正在开发一种与英特尔现有技术类似的先进芯片封装技术。这表明,这家全球领先的芯片制造商对来自远距离竞争对手的挑战感到担忧。芯片封装是芯片生产的最后阶段,在这个阶段,将各个硅片组装成一个整体,并将它们连接起来,使它们能够作为一个整体工作,并连接到计算机的其他部分。()
| 排名 | # | 交易平台 | 24H成交额 | 成交涨跌幅 | 活跃度 | 交易平台 | 活跃度 |
|---|---|---|---|---|---|---|---|
| 1 | $180.54亿 | -11.3% | 86.7% | 86.7% | |||
| 2 | $26.23亿 | 0.44% | 68.6% | 68.6% | |||
| 3 | $392.64亿 | -8.36% | 85.4% | 85.4% | |||
| 4 | $9.39亿 | -15.2% | 69.3% | 69.3% | |||
| 5 | $109.91亿 | -6.85% | 65.3% | 65.3% | |||
| 6 | $12.57亿 | -8.19% | 53.3% | 53.3% | |||
| 7 | $2.03亿 | 18.68% | 65.3% | 65.3% | |||
| 8 | $7.37亿 | -8.71% | 68.4% | 68.4% | |||
| 9 | $2.82亿 | -21.18% | 56.9% | 56.9% | |||
| 10 | $72.15亿 | 0.5% | 71.1% | 71.1% | |||
| 11 | $4.47亿 | 5.43% | 36.2% | 36.2% | |||
| 12 | $3,070.59万 | -18.28% | 59.5% | 59.5% | |||
| 13 | $213.64亿 | -0.43% | 31% | 31% | |||
| 14 | $114.10亿 | 1.28% | 76.2% | 76.2% | |||
| 15 | $1.44亿 | -9.47% | 66.9% | 66.9% | |||
| 16 | $107.01亿 | -12.62% | 55.2% | 55.2% | |||
| 17 | $11.85亿 | -6.49% | 26% | 26% | |||
| 18 | $15.95亿 | 27.44% | 46.9% | 46.9% | |||
| 19 | $1.07亿 | -10.61% | 31.5% | 31.5% | |||
| 20 | $1,710.28万 | -20.58% | 58.2% | 58.2% |